34 min
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 3D InCites Podcast
-
- Technology
This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of ...
This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of ...
34 min