3D InCites Podcast Francoise von Trapp

Send us a Text Message.This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology advancements key takeaways from ECTC 2024. Guests includeVikas Gupta and Mark Gerber of ASE Group Rao Bonda and Nathan Whitchurch of Amkor...

Send us a Text Message.Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll learn about the limitations of current photonics technology in data centers and proposes a...

Send us a Text Message.In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West's Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe updates listeners on semiconductor industry growth and challenges, including sustainability, workforce development, and supply c...

Send us a Text Message.Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss the highlights and takeaways from the recent webinar, Evolving HPC and Chiple...

Send us a Text Message.This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates in heterogeneous integration, and how it solves the challenges of forming interconnects through glass substrates. Dave Taraci,...

Send us a Text Message.This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending. Alex Ospina of ACM Research discussed the latest technologies in wafer-level packaging, and the company’s focus on developing novel IP technologies to address...