30 min
Unpacking Semiconductor Packaging: Insights with Jan Vardaman OnTrack: The PCB Design Podcast
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- Tech News
In this episode of the Altium OnTrack Podcast, host Zach Peterson sits down with Jan Vardaman, president and founder of TechSearch International. With decades of experience in semiconductor packaging, Jan shares her expert insights into the global semiconductor industry, focusing on the shift away from Asia for advanced manufacturing and the critical need for an integrated supply chain in the U.S.
This episode not only highlights the technological and industrial shifts in semiconductor packaging but also discusses the economic and policy dimensions affecting the sector.
Key topics covered include:
The transition of high-end semiconductor packaging from Asia to other regions like Taiwan and Korea.
The impact of new facilities in Malaysia on the global supply chain.
The role and challenges of the National Advanced Packaging Manufacturing program in the U.S.
Detailed discussions on substrate manufacturing and advanced assembly operations outside China.
The significance of workforce development in sustaining local manufacturing initiatives.
Future trends and strategies for semiconductor fabrication and assembly in North America.
More Resources:
Follow Jan on LinkedIn
Learn More about TechSearch International
Exclusive 15 Days Free Altium Designer Access
In this episode of the Altium OnTrack Podcast, host Zach Peterson sits down with Jan Vardaman, president and founder of TechSearch International. With decades of experience in semiconductor packaging, Jan shares her expert insights into the global semiconductor industry, focusing on the shift away from Asia for advanced manufacturing and the critical need for an integrated supply chain in the U.S.
This episode not only highlights the technological and industrial shifts in semiconductor packaging but also discusses the economic and policy dimensions affecting the sector.
Key topics covered include:
The transition of high-end semiconductor packaging from Asia to other regions like Taiwan and Korea.
The impact of new facilities in Malaysia on the global supply chain.
The role and challenges of the National Advanced Packaging Manufacturing program in the U.S.
Detailed discussions on substrate manufacturing and advanced assembly operations outside China.
The significance of workforce development in sustaining local manufacturing initiatives.
Future trends and strategies for semiconductor fabrication and assembly in North America.
More Resources:
Follow Jan on LinkedIn
Learn More about TechSearch International
Exclusive 15 Days Free Altium Designer Access
30 min