On the Line with... I-Connect007
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- Technology
On the Line with… Brought to you by I-Connect007. This exciting, new podcast features the latest and future trends having market impact in the electronics industry from the voices of experts.
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PCB 3.0: A New Design Methodology - SI/PI for PCB Designers
Cadence's Brad Griffin joins us in this episode where we discuss how an intelligent system design methodology can move some signal and power integrity decision making into the physical design space, offering real-time feedback.
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Design for Reality: The Intricacies of PCB Drilling
Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department. The discussion also covers the critical relationship between design choices and manufacturing capabilities. Finally, they touch upon the subsequent steps of metalizing the drilled holes through an electrolysis process.
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PCB 3.0: A New Design Methodology - Manufacturing
Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so too do the rulesets designers must abide by. But rather than seeing them as impossible sets of constraints, Davis shares a vision in which designers can maximize their creative efficiencies while relying on ever more complex design rules to keep everything straight.
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Design for Reality: Lamination
Multilayer boards bring along a completely different set of processes. In this installment of “On The Line With…” Matt Stevenson discusses manufacturing techniques for multilayer. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
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PCB 3.0: A New Design Methodology - How Will AI Play a Role
In this episode, our guests are Taylor Hogan and Patrick Davis. We discuss the role Artificial Intelligence (and Machine Learning) play in intelligent system design.
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Designing For Reality: CAM, Materials and Imaging
Now it’s time to roll up our sleeves and get “messy.” Once the CAM preparations are complete, Matt Stevenson explains what happens next. In this episode, Matt Stevenson details the role of materials, stackup considerations, and walks us through what happens in the Imaging process.