3D InCites Podcast Francoise von Trapp

This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. 
Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates in heterogeneous integration, and how it solves the challenges of forming interconnects through glass substrates. 


Dave Taraci, of Carl Zeiss Microscopy, explains how advanced microscopy techniques address the challenge of analyzing mixed material devices such as chiplets and heterogeneous integration packages in microelectronics. 


Ken MacWilliams, of Multibeam, addresses the challenges of chiplet communication with large interposers and high-density interconnects.


Debbie Claire Sanchez of ERS Electronic, GmbH, talks about the company’s culture steeped in diversity, equity, inclusion and belonging.

Charles Woychik, of NHanced Semiconductors, describes how Bob Patti’s leadership and culture of caring at NHanced Technology has created a positive work environment and successful company. 
Craig Bishop of Deca talks about the latest chapter of the Adaptive Patterning story. Adaptive Pad Stacks are a continuation of Adaptive Patterning, addressing misalignment issues in large-scale interposers.

Vikram Turkani, of PulseForge, discusses how ever-thinning wafers used in 3D stacking called for new solutions for temporary bond/debond processes. 
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.EV Group EV Groups supplies high-volume equipment and process solutions for semiconductor manufacturing. KLA, SPTS Division KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more. ASE Group ASE plays a significant role in the development of the world’s most innovative electronics. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.
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This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending. 
 Alex Ospina of ACM Research discussed the latest technologies in wafer-level packaging, and the company’s focus on developing novel IP technologies to address industry challenges. You’ll hear about the company’s new vacuum cleaning tool designed to remove flux from bonds in smaller chiplets. You’ll also learn about the company’s approach to reducing its environmental impact.

Tim Olson, of Deca, shares big news about the company’s collaboration with ASU to create an open lab for innovation for innovation, licensing its M-Series and Adaptive Patterning technology, and working with ASU to outfit a fab with unique equipment.

Laura Mirkarimi and Oliver Zhao, of Adeia, explain the important role optical interferometry plays in atomic-level hybrid bonding. Zhao explains how they are using AI-powered neural networks to identify defects in the hybrid bonding process, with a focus on categorizing defects based on their relevance to certain process steps.

Manuela Junghähnel, of Fraunhofer IZM-ASSID,  explains her new role taking over the leadership of IZM-ASSID, from Jürgen Wolf.  She talks about learning the pilot scale to the production line created by Wolf. She also explains the relationship from the parent IZM and IZM ASSID.

Brian Riley, of QP Technologies, shares a history of advanced packaging technologies, and the company. He describes QPs' proprietary process for flip chip packages, the use of open mold plastic packages, and overmold QFNs.

Justin Locke, of Siemens EDA discusses innovations in functional verification of 3D Heterogeneous integration connectivity. He explains about the importance of formal verification in the design process, highlighting its ability to catch errors early on and prevent physical implementation issues.

Peter Cronin, of MRSI Mycronic talks about new technologies and interconnects in optical packaging, highlighting the need for active alignment tools. He introduces the Active Aligner.
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This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia. 
 Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  

Zachary Holman, of Arizona State University, discusses how ASU’s Fulton School of Engineering is working to advance the college’s research impact in areas such as health, climate, and national security through partnerships with government and industry investments. He highlights ASU’s focus on extending the advanced packaging capabilities of its MacrotTechnology Works (MTW) fab, which allows for larger-scale packaging tools and pilot-to-fab gap closure.  

Holman emphasized the importance of providing hands-on experience with state-of-the-art tools and materials for students. This will help provide a skilled workforce that can operate and maintain the latest equipment.  Holman also discussed how ASU is building a platform to democratize innovation by providing access to R&D capabilities for startups and small businesses. 

Mark Litecky, of Skywater, highlights the need for secure supply chain management and proprietary technology management in the U.S. semiconductor industry. He also stressed the importance of having global capabilities and secure supply chain management in the US, while avoiding duplication in different regions.
 
Litecky also highlighted workforce development, emphasizing the need for more people to understand the value of the field and the various career paths available. 
 Contact the Panelists on LinkedIn
Dan Berger, Associate Director, NAPMPZachary Holman, Vice Dean, Arizona State University Mark Litecky, Chief Revenue Officer, SkywaterHow to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.Support the Show.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. 
 Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law. 
You’ll learn about: 
Chiplets architectures for high-performance applications How chiplets can enable foundational AI models that can be applied to various business use cases Challenges in chiplet design and test The importance of open interface standards Contact our guests on LinkedIn:
Arvind Kumar, IBM Hemanth Dhavaleswarapu, AMD Pooya Tadeyon, Intel  Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry. 
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.IMAPS InternationalIMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.IMAPS Device Packaging ConferenceInterconnects for Tomorrow’s Applications


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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal.   Panelists include: 
Manfred Horstmann, GM and SVP GlobalFoundries DresdenThomas Richter, Senior Vice President & Managing Director, Infineon Technologies DresdenJuergen Schmidt, VP Semiconductor Manufacturing Frontend, Robert Bosch GmbHAndreas Lippert, Head of Department (Vice President) Acquisition, Inward Investment, Saxony Economic Development Corporation The discussion broadened to include the chip industry’s role in sustainability and talent development. Reducing Scope 3 emissions and addressing supply chain challenges are key topics.  
 
 From this conversation, you’ll discover: 
Lessons learned from COVID for creating a resilient supply chainEurope's value proposition for investment in the semiconductor industryGermany’s strengths and unique selling points How to address the talent crisis  Cost management in the semiconductor industry  
 
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This week’s episode was recorded at ISS Europe, in Vienna, where the European semiconductor industries key strategists gathered to plan the path forward and forge a sustainable path to securing 20% of the global semiconductor market. One of the main topics continues to be building a resilient semiconductor supply chain. 
In the first segment of the episode, Françoise speaks with Sandrine Bronner, VP of supply chain, in the semiconductor division of Edwards Vacuum. They discuss her approach to creating end-to-end semiconductor supply chain resilience.  
 
You’ll learn how to adapt to a changing environment through a positive approach that emphasizes risk management and supplier assessment.  You’ll also learn about the benefits of diversifying suppliers of critical components, and how designing in multiple sources can help create resilience in your supply chain. 
In the second segment of the episode, Françoise hands over the mic to Michael Alexander, of Roland Berger, who led the Panel discussion: Powering Europe's Future - The Impact of Geopolitics on Energy.  Panelists include: 
 Katharina Westrich, Global Head of Vertical Management Semiconductor, Digital Industries, Siemens AGYvonne Keil, Director Global Procurement, GlobalFoundriesNicolas Leterrier, Semiconductor Sustainability Business Leader, Schneider Electric The group discusses the energy industry’s supply shortage and geopolitical effects, particularly its impact on the European sector of the semiconductor supply chain. You’ll learn about the shift from centralized to distributed energy systems and the potential for AI to improve energy efficiency and sustainability. You’ll also learn about the need for green energy in the semiconductor industry, and the impact it may have on cost. 
 The conversation shifts to the need to invest in sustainability improvement and upgrades to legacy fabs, and the importance of being willing to pay a premium for green products. 
How to Start a Podcast Guide: The Complete GuideLearn how to plan, record, and launch your podcast with this illustrated guide.SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the Show.
Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.