EP024-A Deep Dive into SMD and NSMD Pads for Enhanced BGA Performance

This deep dive compares SMD and NSMD pad designs for BGA solder joint reliability, focusing on cracking resistance and void reduction. SMD pads offer stronger board adhesion for mechanical stress resistance, while NSMD pads generally provide better solderability and potentially fewer voids. The choice involves trade-offs. Crucially, preventing cracking largely depends on the product's overall mechanical design, not just the pad. (Revised on 2025/04/28 at 17:50: Changed opening music.)

Read more articles on our blog:
✅Differences, advantages, disadvantages, and recommendations for SMD and NSMD pad designs https://mpe.researchmfg.com/recommendations-smd-nsmd-pad-designs/
✅Copper Defined vs. Solder Mask Defined pad design for BGA soldering strength https://mpe.researchmfg.com/bga-pad-design/
✅Preventing BGA Solder Joint Cracking: Strengthening Design from the https://mpe.researchmfg.com/bga-design-prevent-crack/
✅Why BGA soldering ball always crack(1)? Stress is bigger than bonding-force https://mpe.researchmfg.com/stress-bonding-force/
✅Preventing Solder Cracks in BGA Designs: Strengthening Tips from the Design End https://mpe.researchmfg.com/bga-design-prevent-crack-2/
✅What Is Solder Mask (S/M)? What Is Its Purpose on a PCB? Why Is It Usually Green?https://mpe.researchmfg.com/soldermask/

Watch more on YouTube:
🛠️What is IMC (Intermetallic Compounds) part I? The role of IMC plays in the soldering https://youtu.be/bPJcJpjAd9k
🛠️What is IMC (Intermetallic Compounds) part II? The different between IMC, alloy, eutectic? https://youtu.be/rAg4pS9EKn0
🛠️What is IMC (Intermetallic Compounds) part III? Explain Alloy, Eutectic in detail? https://youtu.be/I8V6PwPCXH8
🛠️What is IMC (Intermetallic Compounds) part IV? how to judge IMC healthy? https://youtu.be/J094_lytNP4
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