Inside Electronics

Endeavor Business Media
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Inside Electronics

Electronic Design has been serving the engineering community with pride for decades, providing you with news, commentary, and interviews about what is going on in the industry. Now, we are expanding that footprint with our new podcast, Inside Electronics. Hosted by industry veteran Alix Paultre, the podcast will bring you commentary, news, and interviews about the things going on in the electronic design engineering community and its surrounding business ecosystem.

  1. قبل ٦ أيام

    Find Out About Network-on-Chip Technology

    Today’s system-on-chips (SoC) are very complex. They have multiple cores and often many different types of cores including CPUs, GPUs, and NPUs. Connecting these to peripherals and memory as well typically include one or more network-on-chips (NoC). In this podcast guest host Bill Wong talks with Andy Nightingale, VP Product Management and Marketing at Arteris, about NoCs.

    ١٨ من الدقائق

  2. ١٩ ربيع الآخر

    Practical Spiking Neural Networks

    In this episode of Inside Electronics, Senior Content Director Bill Wong talks with Steve Brightfield, CMO at BrainChip, about neuromorphic computing in the form of spiking neural networks (SNN). SNNs take an event-based approach to artificial intelligence and machine learning (AI/ML). Brainchip’s Akido technology implements SNNs in hardware providing similar acceleration support that existing neural processing units (NPU) provide but with significantly better performance and lower power requirements.

    ١٦ من الدقائق

  3. ١٢ ربيع الآخر

    Putting Time Sensitive Networking (TSN) into Products

    Industrial automation is getting real (time) with time sensitive networking (TSN). This open standard delivers determinism to Ethernet control networks and it works with wireless networks as well. Senior Content Director Bill Wong talks with Tom Burke, Global Strategic Advisor, CC-Link Partner Association (CPLA) about how TSN works and why it is so important to industrial automation applications.

    ١٣ من الدقائق

  4. ٥ ربيع الآخر

    Making Sense of the Maker Movement

    The Maker Movement is a relatively new phenomenon in society...or is it? The desire to understand technology and create things is a drive that has existed in people since the first devices were created. We sit down with Electronic Design editors Andy Turudic and Cabe Atwell for a discussion about the Maker Movement, Tinkerers, and engineering.

    ٢٥ من الدقائق

  5. ٢٨ ربيع الأول

    Analog ASIC Course Tapes Out Real Silicon to TI's Advanced 300mm Fa

    In this episode, Andy Turudic talks with Georgia Tech’s Professor Shaolam Li about their ECE department’s new analog IC design course where close to a dozen teams of three undergrad and one graduate student are fully hands-on designing real silicon, from schematic through tapeout, with resumption of the course to perform functional verification in a returning semester, after fabrication on a 300mm wafer by Texas Instruments.

    ٢٢ من الدقائق

  6. ٢١ ربيع الأول

    Addressing the Challenges in Advanced Logic Semiconductor Manufacturing

    Making logic chips has never been an easy task, and it is one that has been further challenged by advances in scaling as well as advanced topologies like chiplets. From the race to 2nm-foundry creation for next-generation wafer development and the related issues of packaging, engineers must develop new solutions. In this episode, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.

    ١٩ من الدقائق

  7. ١٤ ربيع الأول

    Optical Chiplet Interconnect Promises to Accelerate Demanding Computing Applications

    The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena  announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.

    ٢٠ من الدقائق

  8. ٧ ربيع الأول

    Developing Advanced Infrastructures for Data Center and AI SoC Applications

    The increasing demand for high-performance computing for next-generation AI and advanced data centers is putting pressure on designers to field the latest data-management solutions. Addressing this demand, Rambus recently unveiled an updated PCI Express 7.0 IP portfolio, encompassing a comprehensive suite of IP solutions, as well as a controller IP for GDDR7 to allow for greater speeds and bandwidths to support generative AI workloads. These applications consume memory at an unprecedented pace, and the new controller IP will unlock more memory for AI and high-performance computing applications, particularly in inferencing and at the network’s edge. In this podcast we talk with Lou Ternullo, Senior Director of IP Solutions at Rambus, about how the GenAI boom is pushing new advancements in innovations in the memory space.

    ١٨ من الدقائق
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Electronic Design has been serving the engineering community with pride for decades, providing you with news, commentary, and interviews about what is going on in the industry. Now, we are expanding that footprint with our new podcast, Inside Electronics. Hosted by industry veteran Alix Paultre, the podcast will bring you commentary, news, and interviews about the things going on in the electronic design engineering community and its surrounding business ecosystem.

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