3D InCites Podcast Francoise von Trapp

In this episode, Françoise von Trapp hands over the mike to imec’s Katrien Marent, who hosted imec’s ITF Towards NetZero at SEMICON Europa. She introduces a panel discussion on Collaborative Strategies and Practical Solutions Toward a More Sustainable Semiconductors Future. 
 The panel kicks off by polling the audience on what they think are the most pressing issues facing the semiconductor industry as it endeavors to reduce its carbon footprint while simultaneously growing to meet the demands of semiconductor devices, many of which will help other industries on their paths to sustainability. 
The panel tackles some grave and difficult questions and offers some useful advice on how to collaborate as an industry and the importance of individual efforts made by companies. What is the role of innovation in achieving these goals? Do we need to have standardization around data? Do we need to report more transparency? 
 In some places, you’ll hear instances of the audience polling and the results of those informing the questions asked by panel moderator, Jan-Hinnerk Mohr, Managing Director & Partner, Boston Consulting Group.  
Panelists   
Emily Gallagher, Principal Member of Technical Staff, imecJean-Marc Girard, CTO and SVP of Manufacturing Technologies, Air Liquide Advanced MaterialsBenjamin Sokolowski, Managing Director & VP Government Affairs EMEA, QualcommBill Lussier, Senior Vice President Regional Sales & Deputy GM, Tokyo Electron Europe Ltd.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member!

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This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. 
The topic of the week was Shaping a Sustainable $1 Trillion Era. Members weigh in on what their companies are doing to support this effort. They also discuss their impression of the show, what they were showcasing, and their latest news. 


Peter Dijkstra, Trymax Semiconductor, updates us on activities at Trymax USA and shares news of his participation at a Dutch and Flemish delegation in Phoenix Arizona in early December. 


Mike Motherway, Cimetrix by PDF Solutions, talks about the role cloud-native data tools for AI applications play in global fab expansion. 


Debbie Claire Sanchez at ERS Electronic explains the company’s partnership with PulseForge to bring photonic debonding to their product portfolio as an equipment integrator of this technology. 


David Wang and Jim Straus of ACM Research share the news of the company’s expansions in Asia as well as the Grand Opening of its new office in Portland, Oregon.


 Hans Peters and Emerald Grieg, PTW Group,  introduce a new tool line, SpinTec, established to renew and restore legacy SEZ single wet wafer tools. 


 Abul Lateef, PlasmaTherm, talks about the company’s latest acquisition of Milan-based Thin Film Equipment, to complete PlasmaTherm’s sputtering and PVD portfolio, and put them near significant customers in Italy. 


 Neil O’Brien, Finetech, talks about the growing need for high-accuracy die-bonders, and how that’s driving a need for full production tools based on its tabletop machines originally developed for academia. 


 Harald Eppinger, Koh Young Europe, explains how the company’s 3D optical measurement tools deliver precise data that helps to visualize advanced packaging processes to improve quality and reduce failures.  


Dieter Rathai, DR Yield,  shares some feedback from the Fab Manager Forum and how he uses that information to inform his business and improve his company’s product. 


Spencer Wall, Jeroen Haex, and Michael Murray, of DSV Solutions explain the role a logistics service provider can play in shaping a sustainable $Trillion Era through inventory and supply chain strategies, as well as a commitment to certified alternative fuels for all modes of transport.  
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This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about the roles their company plays in this task. 
From Paul de Bot of TSMC Europe, you’ll learn about the company’s R&D investment in continued CMOS scaling and 3D integration, as well as a $32B investment worldwide in capacity expansion to support Moore’s Law, specialty technologies for the automotive market, and advanced packaging.  De Bot explains the different strategies used in Europe, including a partnership with Bosch, Infineon, and NXP, and addresses the company’s commitment to green manufacturing and sustainability.  

Imec’s Luc Van Den hove explains what he means by “polycrisis” – a word he used to describe the multitude of challenges facing the world, with a specific focus on climate change, and how imec is working to solve these challenges using AI and data analysis. He also talks about the conundrum of using semiconductors to solve climate change, while trying to half our own carbon footprint. Imec is bringing together the entire ecosystem to address these challenges together. 

Rebecca Dobson, of our member company, Cadence explains the complexities of generative AI, and how it will be a key enabler of growth for the European microelectronics industry. You’ll learn how generative AI impacts team productivity and design team structure, and how it can be used to help us reach our sustainability goals, as well as how it can be used to increase productivity. 

Lihong Cao, of ASE Group, talks about the challenges the advanced packaging sector is facing as we enter the chiplet era and how to address them. You’ll learn about the importance of developing an integrated chiplet design ecosystem. You’ll also learn how heterogeneous integration can help solve industry challenges in a sustainable way. 
Contact our Speakers on LinkedIn:
·      Paul de Bot, General Manager, EMEA at TSMC Europe
·      Luc Van Den hove, President and CEO at imec 
·      Rebecca Dobson, Corporate VP, EMEA, Cadence 
Lihong Cao, Senior Director, Engineering/Technical Marketing, ASE Group 
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners.
You’ll learn about the driving applications for advanced IC substrates, including data storage, data speed, and the automotive industry. You’ll hear about the challenges of keeping up with advanced node technology and the need for reliable interconnects in the assembly industry.
Other topics include the oversupply situation in the substrate industry, the importance of maintaining R&D activities, the lack of substrate manufacturing in the US, and the impact of geopolitics on the supply chain.  
Connect with our speakers on LinkedIn:
 Markus Leitgeb, R&D ManagerTony Gueli, Key Account Director
 
 
AT&S AT&S is a global manufacturer of high-end PCBs and IC substrates for microelectronics applications. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This Member Spotlight episode was recorded live at the IMAPS International Symposium. Françoise von Trapp speaks with community members who attended and exhibited about what they were showcasing, and what they learned.  
John Lannon and Rex Anderson, Micross Components, helped demystify the multiple government funding efforts to onshore advanced packaging.

Casey Krawiec of StratEdge Corporation talks about the company’s role in delivering packaging technology for high-frequency applications.

Brian Schmaltz, Namics Corporation, talks about the company’s efforts to eliminate harmful PFAS chemicals from their portfolio of products.

Vahid Akhavan, PulseForge explains how the company’s core competency — high-powered photonic-based pulsed light technology — is being used for temporary bond/debond processes.

Ajinomoto Fine Techno’s Habib Hichri talked about developments beyond its core ABF (Ajinomoto Buil-up Film) to meet the needs of next-generation thin and large packages.

QP Technologies' CEO Dick Otte, explains why QP has decided to NOT pursue CHIPS for America Act funding.

Paul Ballentine, the co-founder of Mosaic Microsystems, talked about his involvement with the U.S. Government in building out the advanced packaging cluster in Rochester New York.

Peter Cronin, MRSI Systems, talked about the company’s latest foray into die-bonding tools – the MRSI 705 HF.

Onto Innovation’s Keith Best discussed the implications of Intel’s announcement that they’ve developed a glass core substrate technology for next-generation advanced packaging.

Read the accompanying blog post here.
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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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In this panel discussion, recorded live at the International Microelectronics and Packaging Society International Symposium, Françoise hands over the mike to Dan Krueger, Honeywell, as he moderates a panel on Diversity in Packaging, Past, Present, and Future. Don’t miss this lively town hall discussion on many important topics in today’s challenging work environment, including the important differences between equity and equality in the workplace. 
You’ll hear representatives of different generations of IMAPS leadership discuss their experiences as women making careers in the microelectronics industry, the diverse perspectives that each generation experienced, the progress they see in the industry, and suggestions for work left to be done and how to achieve it. They also provide tips on how to improve DEI at companies going forward, the importance of mentorship, and how to be better allies to your peers.  
Moderated by Daniel Krueger, Panelists include: 
·      Beth Keser, Zero ASIC 
·      Erica Folk, Northrop Grumman
·      Robin Davis, Deca
·      Amy Lujan, Savansys
·      Susan Trulli, Retired from Raytheon
 
Next week, we wrap up our coverage of the IMAPS Symposium with our Member Spotlight episode, interviewing 3D InCites Community Members about what they showcased and what they learned at the event. 
Support the showBecome a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.