11 episodes

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

3D InCites Podcast Francoise von Trapp

    • Technology
    • 5.0 • 2 Ratings

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.

    A Conversation about The Importance of Package Design for Chiplet Integration

    A Conversation about The Importance of Package Design for Chiplet Integration

    Chiplets are the new “It” heterogeneous integration technology. Many believe they provide the solution to power, performance, area and cost (PPAC) for everything from mobile computing and automotive applications, to 5G, high-performance computing, and artificial intelligence. In this podcast episode, Françoise speaks with 3D InCites’ Community Members, Kevin Rinebold of Siemens EDA, and Robin Davis of Deca to explore how successful chiplet integration begins with a collaborative design flow. 
    To get started, we’ll get some of the chiplet back-stories, beginning with the advantages of disaggregating SoC into hardened IP blocks of different nodes, and reintegrating them on an “interconnect fabric.” From there, we define what we mean by chiplets, what differentiates them from system-in-package, and how different advanced packaging architectures can be implemented to create chiplet packaging.  We also discuss the main challenges of designing chiplet packages; such as who owns the design? Is it the IC designer or package designer? How do we manage the die shift? How do we manage multiple designs?
    Additionally, Kevin and Robin talk about their companies’ respective design kits, and how they are working together to enable a chiplet ecosystem.
    Papers/presentations referenced by Kevin and Robin include: 
    Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration – Siemens EDA 
    Adaptive Patterning Techniques for the Chiplet Era – Deca 
    Contact the Speakers on LinkedIn:
     Kevin Rinebold
    Robin (Gabriel) Davis
    Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.

    • 37 min
    A Conversation about Microelectronics Events of the Future

    A Conversation about Microelectronics Events of the Future

    In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of the key business development tools of the microelectronics industry: technology conferences and trade shows. In this podcast, we’re talking to several industry event organizers to get their take on the past year of what worked, what didn’t, and thoughts about the future of industry events as we transition back to in-person meetings. 
     Rich Rice, head of marketing for North America at ASE, represented IMAPS as he completes his year as society president. He talked about the challenge of providing the type of content expected by its members in a new and interesting way. Dave Anderson, President of the Americas for SEMI, offers some insight on the advantages of virtual events with regard to tracking and metrics, and how SEMI has worked to improve the experience for its members throughout the pandemic. 
     We talk about how everyone is craving a return to face-to-face activities, how that may roll out with local events first, hopefully, followed by international events, and how to implement a hybrid model going forward. We also talk about how the combination of COVID and an increased concern for a sustainable future is impacting how our industry conducts business, and what that may mean for business travel going forward. 
    Find more information on IMAPS global events at IMAPS.org
    Find more information on SEMI global events at SEMI.org
    Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.

    • 25 min
    A Conversation about the European Semiconductor Market and the Supply Chain

    A Conversation about the European Semiconductor Market and the Supply Chain

    Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply chain. To address these topics and more, SEMI Europe is holding its first in-person event since the start of COVID.  Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.
    In this episode, we speak with Steffen Krohnert, ESPAT Consulting, and Christian Roessle MSE Group about the semiconductor supply challenges Europe is facing, particularly for low-volume advanced packaging, and how members of the SEMI integrated Packaging, Assembly and Test Technology Community (ESiPAT-TC), are addressing them. We also talk about the upcoming seminar, and what attendees will gain by attending.

    To learn more about SEMI Europe's Packaging Technology Seminar, visit the website here.

    Contact Steffen Kröhnert at ESPAT Consulting
    Contact Christian Roessle at MST Group

    • 34 min
    A Conversation About Reshoring Advanced Packaging in the U.S.

    A Conversation About Reshoring Advanced Packaging in the U.S.

    The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which earmarks $52bn for new chip manufacturing and research. This is now being debated in the House of Representatives. There’s a lot to unpack here – what we’re focusing on today is how all of this could impact advanced packaging and test in the US – To talk about this, we invited 3D InCites Community Members. Bob Patti, of Nhanced Semiconductor, Alan Huffman, of Micross Components, and Dick Otte, of QP Technologies. 
     The conversation covers a wide range of questions: Will the $52Bn be enough? How should those funds be best allocated? What will the impact be on small entities? Where will the workforce to support it come from? How do we create a US supply chain? Are we politicizing chip manufacturing? How do we ensure that Foundry 2.0 adds IP value and attracts new talent? Is the answer a vertically integrated advanced packaging company?  Should we create a consortium of advanced packaging companies and use the government funding to fill in the gaps? 
     Tune in to hear the answers to these questions and much more. 
    If you'd like to learn more about some of these 3D InCites Community Members, visit their profiles:
    ·      Nhanced Semiconductor 
    ·      Micross 
    ·      QP Technologies 
    You can also contact the guest directly via email:
    Bob Patti, Nhanced Semiconductor 
    Allan Huffman, Micross 
    Dick  Otte, QP Technologies
     
     

    • 55 min
    Member Spotlight: A Conversation About Working on the Mars Rover Perseverance

    Member Spotlight: A Conversation About Working on the Mars Rover Perseverance

    Earlier this year, on February 18, 2021, the next-generation Mars Rover, Perseverance, successfully landed on Mars. According to Earth and Sky Magazine, Perseverance was the first artificial object to land on Mars since 2018, and the first Rover to land since 2012 when Curiosity touched down. 

    Perseverance traveled 293 million miles (472 million km) – over 203 days, and hit the Martian atmosphere traveling at almost 12,000 miles per hour (19,000 kmh), About a mile above Mars surface, the descent module fired its engines, while a terrain relative navigation system scanned and analyzed the terrain below, then matched it up with maps in its database to prepare for touchdown. 
     All this requires some sophisticated and rugged microelectronics and semiconductor technology. So, what makes this even more exciting for us at 3D InCites, is that 3D PLUS, winner of the 2021 Device of the Year Award, and Community Member, StratEdge Corporation, both provided the advanced packaging technology to make this possible.
     In this episode, we talk to Patrice Benard, of 3D Plus, and Casey Krawiec, of StratEdge Corporation to learn about the experience of working on this exciting project. 
    Stratedge Corporation specializes in high frequency, high power, high-reliability semiconductor packages. Markets served include telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole.  Learn more at Stratedge.com.
    Email Casey Krawiec 
    3D Plus provides advanced, high-density 3D microelectronic products to space, avionics, and defense markets. Learn more at 3D-Plus.com.
    Email Patrice Benard

    • 28 min
    A Conversation About How to Be Better Allies to our LGBTQ+ Peers in the Semiconductor Industry and Beyond

    A Conversation About How to Be Better Allies to our LGBTQ+ Peers in the Semiconductor Industry and Beyond

    In the aftermath of Gay Pride Month, we bring you a very special episode of the 3D InCites Podcast. Even though it's July, we believe it is important to be allies to the LGBTQ community all year round.

    While many companies showed support for the LGBTQ+ community by adapting their logos with rainbow colors and sharing supportive messaging and banners on social media, SEMI Foundation went a step further and commissioned a blog post written by Maria Vetrano titled, "LGBTQIA+ Visibility and Acceptance in the Chip Industry.".

    The blog post was enlightening, to say the least, and it inspired us to learn more about how those of us in the semiconductor industry can be better allies and accomplices to our LGBTQ+ colleagues. To do that, we invited Maria and SEMI Foundation's Michelle Williams-Vaden to join us in a conversation. 

    If you have more questions, we invite you to reach out to Michelle at SEMI Foundation: mwilliams@semi.org,  and/or Maria Vetrano on Linked In. 
    If you'd like to learn more about some of the organizations mentioned in this episode, visit their websites:

    SEMI Foundation
    Outright Action International
    GLSEN
    Human Rights Campaign
    The Trevor Project
    Click here to learn more about how 3D InCites is supporting Diversity, Equity, and Inclusion in the semiconductor industry, and how you can help,

    • 33 min

Customer Reviews

5.0 out of 5
2 Ratings

2 Ratings

Top Podcasts In Technology