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PCEA

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

  1. JAN 28

    RM 185: How Accuracy & Force Compliance Contribute to Better Quality & Reliability, with Michael Sivigny

    In electronics manufacturing, defects don’t usually announce themselves. They happen in milliseconds, far faster than human perception, and often long before anyone realizes a process has drifted out of control. By the time failures show up in test, inspection, or worse, in the field, the root cause may be buried deep inside machine behavior that no one thought to question. When machines are assumed to be accurate instead of proven to be accurate, and when force is set but not verified, hidden variation creeps in. That variation can translate directly into cracked components, misalignment, latent damage, and long-term reliability risk. Michael Sivigny is SMT productivity & profit strategist and owner and general manager CeTaQ Americas, a company that has spent decades doing what most factories don’t, objectively measuring machine performance under real production conditions.  Sivigny's work has repeatedly shown that even well-maintained, recently serviced equipment can operate outside of specification, quietly generating defects at high speed. In this conversation, we’ll dig into how accuracy validation and force measurement expose problems traditional troubleshooting misses, why OEM calibration alone is no longer enough for today’s miniaturized electronics, and how statistically sound measurement practices improve not only yield and uptime, but long-term product reliability. If you believe reliability starts long before functional test, this is a conversation you won’t want to miss.

    48 min
  2. 11/12/2025

    RM 180: Low Temp Soldering for a High-Reliability World

    Note: This is the fourth of four episodes on the subject of soldering materials.   Today, we're diving into a topic that's reshaping how we think about thermal management, energy efficiency, and long-term performance in electronics manufacturing—low temperature soldering. Joining Mike Konrad is Dr. HongWen Zhang, principal metallurgist and R&D manager of the Alloy Group at Indium Corporation.   Dr. Zhang is not only a seasoned materials scientist with a Ph.D. in materials science and engineering, a master’s in materials science and engineering and in mechanical engineering and a bachelor’s in metallurgical physical chemistry he’s also coinventor of Durafuse, a family of solder alloys that are redefining what's possible at low reflow temperatures—which, reportedly, does not compromise reliability.   In this episode, we’ll explore how low temperature solders are helping manufacturers lower energy consumption, protect heat-sensitive components, and still meet the rigorous mechanical and environmental demands of today’s electronics—from wearables to wafer-level packaging. We’ll also talk about the challenges of brittleness, drop shock resistance, activation and encapsulation of no clean activators, and how cutting-edge materials research is solving problems that used to be considered trade-offs.   Whether you’re a reliability engineer, a process expert, or just solder-curious, this episode is packed with insights you won’t want to miss.

    53 min

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Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)