On the Line with...

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On the Line with… Brought to you by I-Connect007. This exciting, new podcast features the latest and future trends having market impact in the electronics industry from the voices of experts.

16 thg 7

Meet the Author—The Printed Circuit Assembler's Guide to... Design for Test: A Practical Guide to Test and Inspection

TTCI's president, Bert Horner, discusses the "Butterfly Effect" of Design for Test in his new book, "The Printed Circuit Assembler's Guide to... Design for Test." In his conversation with Nolan Johnson, Horner explains how planning for testability can pay huge dividends in reliability and profitability throughout the product's life cycle.
9 thg 7

Meet the Author—The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings: Addressing Future Manufacturing Speed and Need

Authors Brian Chislea and Cody Schoener, PhD, share a conversation with Nolan Johnson on their latest book, "The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings." Chislea and Schoener talk about why this book is so important now, and the advantages and applications for UV curable conformal coatings. Central to the discussion is how such coatings can simplify manufacturing, improve product reliability, and return valuable floor real estate.
30 thg 4

PCB Materials: What’s Next? Innovations Shaping the PCB Industry

In the series wrap-up, Marcy LaRont discusses with CTO Kirk Thompson the turning point facing the PCB industry as innovation speeds up. With increasing data rates, power density, AI infrastructure, flexible electronics, photonics, and chiplet integration, traditional material assumptions are no longer enough. Kirk explains how advanced materials now enable higher speeds, better thermal management, and more precise dimensional control, while balancing manufacturability. The merging of PCBs and advanced packaging is both exciting and challenging, requiring substrate-like precision at scale. In the end, early collaboration across the ecosystem and smarter, more integrated materials will shape the next generation of cutting-edge PCBs.
15 thg 4

PCB Materials: The Global Supply Chain—Lessons From Disruption

Lessons learned from recent global supply chain disruptions. Drawing on recent events to shed light on current issues, Jim explains that many supply chain weaknesses experienced during the COVID-19 pandemic were structural, as geographic and supplier-base efficiency had been prioritized over resilience. However, achieving true resilience requires diversification, scenario planning, strategic inventory, and strong partnerships. Jim states that supply chain volatility is now constant, and companies must institutionalize lessons learned to stay prepared.
1 thg 4

Reliability Under Pressure—PCBs in Harsh Environments

Marcy LaRont speaks with Laura Martin, Director of Strategic Markets at Isola, about PCB reliability in harsh environments across aerospace, automotive, and defense applications. Martin explains that reliability under pressure involves managing cyclic strain within composite materials—not just meeting temperature limits. Thermal cycling, Z-axis expansion, moisture under bias, and anisotropic behavior all contribute to long-term fatigue and failure. Common failure mechanisms such as plated through-hole cracking and interfacial delamination are discussed, highlighting the increasing importance of material selection based on strain management rather than just Tg. The conversation emphasizes designing for real-world stress factors to ensure long-term durability and performance.
19 thg 3

The Green Circuit—Sustainability in PCB Manufacturing

As each area of electronics and manufacturing take a more serious look at sustainability and end product circularity, the base material of the PCB should in central in that discussion. In this episode of On the Line with, Isola’s Kirk Thompson explains the “green circuit,” new directions in materials and engineering that address important environmental impact issues such as the amount of energy it takes to process a particular material type, or how much copper is wasted in the process. As engineers seek materials that minimize VOC emissions or are designed for cleaner fabrication, there are many factors to consider. From halogen-free to PFAS to simply avoiding unnecessary extra layers in your board, Kirk has a lot of information you will want to hear.
4 thg 3

5G, AI & Beyond—Designing for High-speed Performance

It's no surprise to anyone that AI is transforming the rules of electronics, demanding speed, power, and frequency performance beyond what traditional electronics offer. Is AI rendering yesterday’s materials obsolete? In this episode of On the Line With, Isola's Drew Delaney offers a firsthand look at the materials science quietly powering everything from hyperscale AI data centers to 5G antennas and rugged edge devices. From ultra-low-loss laminates measured in thousandths of a decimal to PCBs designed to withstand liquid cooling, desert heat, and a decade of use without maintenance, what properties must these materials have to thrive in a world rushing toward high-speed performance beyond 400G? Drew Delaney has the details.
17 thg 2

Material Selection—The Key to Manufacturing Success

The base laminate of a printed circuit board is its literal and functional foundation. Making the right material choice for your build is key to manufacturing success and product reliability. In this episode of On the Line With, Sean Mirshafiei from Isola talks about the critical role of PCB base material has played, and continues to play, in electronics manufacturing. As today's technology demands drive the development of new material solutions, Sean also discussed Isola's role in the electronics manufacturing ecosystem and the material suites they are bringing to the market today to address these challenging demands, especially in terms of reliability in harsh environments, signal integrity, and power considerations.

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On the Line with… Brought to you by I-Connect007. This exciting, new podcast features the latest and future trends having market impact in the electronics industry from the voices of experts.

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I-Connect007
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2024 - 2026
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66
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