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Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

  1. 1d ago

    RM 193: Why Post-Reflow Cleaning Is Becoming Mainstream Again

    For decades, cleaning circuit assemblies after soldering was not optional. It was standard practice across the electronics manufacturing industry. Then, almost overnight, that changed. In this episode of Reliability Matters, Mike Konrad takes you back to the origins of that shift. From the widespread use of CFC-based cleaning solvents to the global impact of the Montreal Protocol, this episode explains how environmental regulation led to the rapid adoption of no-clean flux and the removal of cleaning as a standard process step. But that decision came with assumptions. Assumptions based on larger components, wider spacing, and assemblies that were far more tolerant of residues than what we see today. As electronics evolved, so did the risk. Miniaturization, increased component density, and the expansion of electronics into harsh environments have dramatically reduced the tolerance for contamination. And when cleaning was removed, it wasn’t just flux that remained. It was the totality of residues introduced throughout the manufacturing process. This episode walks through how those residues, combined with moisture and electrical bias, can lead to electrochemical migration, including parasitic leakage and dendritic growth, often resulting in delayed or intermittent failures. This is the story of how we got here. In Part 2, we bring this discussion into the present. What does “clean” actually mean today? Why did the industry move away from fixed cleanliness limits? And why is cleaning once again becoming a critical part of modern electronics manufacturing? If you’ve ever asked the question, “Do I really need to clean?” Part 2 will challenge how you think about the answer.

    13 min
  2. Apr 16

    RM 187: An Academic Look at Al in Electronics Manufacturing: Where It Works, Fails, and Why It Matters

    Artificial intelligence is being promoted as the next revolution in electronics manufacturing, but what happens when the people evaluating it aren’t traditional AI experts, aren’t software vendors, and aren’t selling anything?  Today’s conversation brings together engineers and professors who live at the intersection of education, reliability, and real-world manufacturing to separate meaningful progress from speculation. This episode is all about “AI in Action: Progress, Pitfalls, and the Future of Electronics.” Artificial intelligence is becoming a frequent topic in electronics manufacturing—from inspection and process optimization to predictive maintenance and reliability modeling.  But rather than approaching this conversation from the standpoint of AI evangelists or software developers, we’re taking a different path. Mike Konrad's panelists are Eva Hymes, Hayden Lee, Dr. Ron Lasky, Dr. John Evans, and Dr. Pradeep Lall.  None of today’s panelists claims to be AI experts. Instead, they are engineers and professors who sit at the intersection of education, engineering, and real-world manufacturing challenges. Their perspective is grounded in physics, data, reliability science, and decades of experience teaching the next generation of engineers—many of whom will be working alongside AI-driven tools whether they choose to or not. Because all of the panelists come from academia, this conversation intentionally steps back from hype and buzzwords. We’ll focus on how AI is actually being used, where it shows promise, where it introduces risk, and where critical gaps still exist—especially in high-reliability electronics manufacturing. We’ll also touch on broader societal questions, including how AI is shaping engineering education and professional intuition.

    59 min

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Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

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